- As a turnkey manufacturing plant for parts mounting, we have a whole lineup of equipment available for prototyping, high-mix low-volume production and mass production depending on the needs for SMT, SMD, DIP, fabrication and final Inspection.
- High density, high precision (±50μm), micro, large and other kinds of mounting is supported with advanced technology.
- We provide our fabrication (processing facility) to fabless companies.
Ultra-fine Pitch Printing
When using the gap print method, which used to be de-facto about 20 years ago, the problem that bridges occur easily and print configuration is not stabilized occurred.
We use the filling type device, which leverages thixotropic properties of soldering, to deal with ultra-fine pitch printing such as bump printing.
High Speed Parts Installation Supporting 0402/0603/1005
In recent years, electronic circuit boards require higher density mounting. To respond to such requirements, it is necessary to provide a solution for high density mounting of microchip parts by decreased pin-pitch mounting and narrow-pitch CPS (Chip Size Package).
We provide solutions for 1005 and 0603 as well as microchip parts such as 0402.
Mounting Variant Parts
We also provide a solution for mounting variant parts such as BGA (BallGrid Array), CSP (Chip Size Package) or Flip Chip.
BGA
＊”QFP”and”SOP”have lead terminals around the parts.
→BGA was developed as a package that enables compactness and in increased number of other pins.
CSP
CSP mounting products inside cavity.
Flip Chip（Flux Transfer Technology）
Transcribe Flux
Mount
＊Because the mounting area is small and wiring is short, it has good electrical properties and is widely used in cell phones and other products that are becoming smaller and thinner.
System-in Package
A semiconductor product that seals multiple chips in a single package, requiring special mounting techniques in some cases.
For example, it combines microprocessor, DRAM and flash memory, structured three-dimensionally inside a single package.
※We will work together with the customers from the design & development stage.
3D mounting
Technology to mount multiple chips in layers three-dimensionally within a package.
3D mounting technology is required to enable System-in Package.
※We will work together with the customers from the design & development stage.
Inspection Equipment
Automatic image inspection equipment (Inline / Outline)
※It supports inline and outline.
Reliability evaluation by x-ray inspection device?
